real challenges facing equipment manufacturers today. The megatrends of global networks,

mobility, cloud and big data are driving growth – but at the same time are disrupting legacy

semiconductor technologies.

It’s a very exciting time for our industry as it continues the massive transformation

to the digital services or on-demand economy. Fueled at its foundation by Moore’s law,

the increasing efficiency of technology is accelerating the rate at which new services

are being invented and existing services are growing.

To compete in today’s insanely competitive markets, OEMs are turning once again to custom

Integrated Circuits as a means for creating high-value, differentiated products.

The biggest challenges facing semiconductor companies today are the need for fast time-to-market

and low cost methods for implementing the designs. At 28nm the cost of the design could

be $75M. When you go to 10nm, the cost would be $250M. But then you need revenues of 10x

your design costs. It doesn’t work. Because there are very few applications that can support

that level of revenue.

So, what is eASIC doing to solve these challenges?

eASIC has invented and brought to market – and is shipping in high volume – a disruptive

custom IC platform. The innovation that is the foundation of the platform is a unique

method of IC customization. The entire platform or IC can be customized for any end application

by changing only one mask layer out of the typical 50 mask layers.

The combination of our co-designed hardware and software platform reduces time-to-market

by up to 50 percent compared to a standard ASIC and improves performance by as much as

2X over an FPGA, while at the same time reducing power consumption compared to an FPGA significantly.

Well, the concept of eASIC in terms of the patterning with a single mask technology is

unique. Here you can have multiple iterations of a design at low cost. So the customer can

decide which version is optimized for their particular application. No other company offers

you that kind of flexibility. And of course you can have fast time to market for your

product and also you can then have customization, which can be unique for the specific needs

of the customer.

We are continually looking for innovative ways to rapidly integrate our customers’

requirements and accelerate their workloads. Intel’s Xeon Processors combined with an

eASIC solution adds yet another dimension to our expanding custom silicon capabilities.

Using the eASIC platform, our customers have brought innovative new products to market

faster and have won their competitive battles with truly differentiated products. Our goal

at eASIC is to revolutionize the custom semiconductor industry.